SUNNYVALE, CA INITIALS--May 24, 1999--AMD today announced the industry's highest performance x86 mobile PC processor available, the Mobile AMD-K6®-III-P. The new Mobile AMD-K6-III-P processor is based on AMD's advanced sixth generation micro-architecture, with AMD's unique TriLevel Cache™ design, and a 100MHz front-side bus. The processor is available immediately at clock speeds of up to 380MHz.

"AMD is introducing another first in the notebook market," said Dana Krelle, vice president of marketing for AMD's Computation Products Group. "The Mobile AMD-K6-III-P processor builds on the success we have had with the previous generation Mobile AMD-K6-2 processor, and extends our mobile offerings into the high-performance notebook space."

"Compaq will use the new Mobile AMD-K6-III-P processor to further extend the performance of our Presario line of mobile Internet PCs and to underscore our commitment to consumers to offer an exceptional combination of industry-leading processing power, 3D computing capability and easy Internet access," said Alex Gruzen, general manager of Compaq's Consumer Mobile Division. "We plan to have systems based on the Mobile AMD-K6-III-P processor available at Compaq's "Built For You" retail Kiosks in the United States and at our web site later this quarter."

Mobile AMD-K6®-III-P Offers Market Leadership Performance
The Mobile AMD-K6-III-P offers market leading Windows® 98 and Windows NT® performance versus competitive mobile processors.

The Mobile AMD-K6-III-P processor incorporates AMD's innovative TriLevel Cache design to enable leading-edge performance. The TriLevel Cache maximizes overall system performance of Mobile AMD-K6-III-P processor-based notebook PCs by delivering the mobile computer industry's largest combined system cache.

The TriLevel Cache architecture includes a full-speed 64KByte Level 1 (L1) cache, an internal full processor-speed backside 256KByte Level 2 (L2) cache, and a 100-MHz frontside bus to an optional external Level 3 (L3) cache of up to 1MByte.

The Mobile AMD-K6-III-P processor also incorporates AMD's 3DNow!™ technology for great performance on applications such as 3D graphics, soft DVD playback and speech recognition algorithms.

The Mobile AMD-K6-III-P processor operates at a core voltage of 2.2 Volts, has an extended case temperature rating of 80°C, and dissipates approximately 12 Watts of power running typical applications.

These 21.3-million transistor processors are manufactured on AMD's 0.25-micron, five-layer-metal process technology at AMD's Fab 25 wafer fabrication facility in Austin, Texas.

About 3DNow!™ Technology
3DNow! technology, developed by AMD, is the first innovation to the x86 architecture that significantly enhances floating-point-intensive 3D graphics and multimedia applications. It uses SIMD (Single Instruction Multiple Data) and other performance enhancements to provide a compelling visual computing experience. AMD introduced this feature to the notebook computing platform in January 1999, with the Mobile AMD-K6-2 processor.

The worldwide installed base of 3DNow! technology-enhanced PCs has grown to more than 12 million desktop and notebook systems spanning all price points. Support for 3DNow! technology exists today in the leading industry-standard application programming interfaces (APIs), including Microsoft's DirectX 6.x and SGI's OpenGL APIs. In addition, numerous hardware and software products have been optimized for 3DNow! technology. A complete list of hardware and software products that support 3DNow! technology, is available at www1.amd.com/products/cpg/3dnow/optimized. Leading software titles optimized for 3DNow! technology are available online at the 3DNow! Technology Aisle on Chumbo.com.

Pricing and Availability
The Mobile AMD-K6-III-P/380 processor is available today, and priced at $349 in 1,000-unit quantities. The 366-MHz version is priced at $316 and the 350-MHz version is priced at $249, both available today and in 1,000-unit quantities.

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